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| 3.8x2.0mm DOME LENS SMD CHIP LED LAMP APED3820MBC BLUE Features lLOW l3.8mmx2.0mm SMT LED,3.2mm THICKNESS. lIDEAL FOR BACKLIGHT AND INDICATOR. lVARIOUS lPACKAGE Description POWER CONSUMPTION. The Blue source color devices are made with GaN on SiC Light Emitting Diode. Static electricity and surge damage the LEDS. It is glove when handling the LEDs. electrically grounded. COLORS AND LENS TYPES AVAILABLE. : 500PCS / REEL. recommended to use a wrist band or anti-electrostatic All devices, equipment and machinery must be Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.2(0.008") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAB0723 APPROVED: J. Lu REV NO: V.4 CHECKED: Allen Liu DATE: APR/04/2003 DRAWN: D.H.FANG PAGE: 1 OF 4 Selection Guide P ar t N o . APED 3820MBC BLUE(GaN) Dic e L en s Ty p e WATER C LEAR Mi n . 10 Iv (m c d ) @ 20 m A Ty p . 25 V i ew i n g An g le 60 (H) 35 (V) 21/2 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25C Sy m b o l p e a k D 1/2 C VF IR P ar am et er Peak Wavelength D omi nate Wavelength Blue Blue D ev i c e Ty p . 430 466 60 100 3.8 4.5 10 Max . Un its nm nm nm pF V uA Tes t C o n d i t i o n s I F =20mA I F =20mA I F =20mA VF=0V;f=1MHz I F =20mA VR = 5V Spectral Li ne Half-wi dth Blue C apaci tance Forward Voltage Reverse C urrent Blue Blue Blue Absolute Maximum Ratings at TA=25C P ar am et er Power di ssi pati on B lu e 105 150 -40C To +85C -40C To +85C 5 30 Un its mW mA V mA Reverse Voltage Peak Forward C urrent [1] D C Forward C urrent Operati ng Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Storage Temperature SPEC NO: DSAB0723 APPROVED: J. Lu REV NO: V.4 CHECKED: Allen Liu DATE: APR/04/2003 DRAWN: D.H.FANG PAGE: 2 OF 4 Blue APED3820MBC SPEC NO: DSAB0723 APPROVED: J. Lu REV NO: V.4 CHECKED: Allen Liu DATE: APR/04/2003 DRAWN: D.H.FANG PAGE: 3 OF 4 APED3820MBC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAB0723 APPROVED: J. Lu REV NO: V.4 CHECKED: Allen Liu DATE: APR/04/2003 DRAWN: D.H.FANG PAGE: 4 OF 4 |
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